Event | Pack Expo International | Chicago | November 3-6

iXAPACK GLOBAL USA will be present from November 03-06 at the Pack Expo International trade show in Chicago, on booth N-5783.

This event will be an opportunity for us to introduce you to our latest solutions, which includes end-of-line equipment, ultrasonic cutting solutions, wrapping machines and weighing, labeling, metal detection systems. All our solutions are manufactured at a single site in France, where we take care of every step from your request to final installation of your equipment.

In the U.S., our local team is based in Milwaukee (WI) to support our customers’ sales and technical needs. This proximity enables us to respond rapidly to your needs

You would like to meet us at the event? Contact us at [email protected] to get your free access to the show!